本作品以交错并联BUCK电路为例,融合AI技术,设计了一套包含需求获取、硬件选型、代码生成、PCB绘制四个方面的全流程电路设计方案,实现效率、体积、重量、成本等多目标的协同优化。
本作品以交错并联BUCK电路为例,融合AI技术,设计了一套包含需求获取、硬件选型、代码生成、PCB绘制四个方面的全流程电路设计方案,实现效率、体积、重量、成本等多目标的协同优化。
A multi-function PCB integrating biomedical signal acquisition (ECG), DC motor control, and advanced power management for wearable applications.
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials