A ruggedized, 6-layer High-Density Interconnect (HDI) carrier board designed to commercialize Raspberry Pi CM4 prototypes into deployable industrial AI products. Engineered specifically for high-vibration, noisy environments (agricultural robotics, factory automation) featuring automotive-grade power protection and high-speed PCIe integration.
Production-ready 3d printer based on a Ender 5 frame, with multifunction tool changing.
A fully autonomous, data-rich hydroponics automation system with precision control and remote monitoring.