A ruggedized, 6-layer High-Density Interconnect (HDI) carrier board designed to commercialize Raspberry Pi CM4 prototypes into deployable industrial AI products. Engineered specifically for high-vibration, noisy environments (agricultural robotics, factory automation) featuring automotive-grade power protection and high-speed PCIe integration.
alllllll iiiiii wanttttt forr christmassssssssssss, is a tiny 3d printed with some pcb to display photos of the year 🤑🤑🤑🤑🤑🤑🤑🤑🤑
Your DCC/Railcom signals and a +5V power source for your microcontroller on a breadboard
Production-ready 3d printer based on a Ender 5 frame, with multifunction tool changing.
PSoM, either Pico System On Module, or Puma System On Module for those who prefer