Audio Augmented Smart Glasses - ESP32, Hardware Build, System Integration, and Firmware (C)
A ruggedized, 6-layer High-Density Interconnect (HDI) carrier board designed to commercialize Raspberry Pi CM4 prototypes into deployable industrial AI products. Engineered specifically for high-vibration, noisy environments (agricultural robotics, factory automation) featuring automotive-grade power protection and high-speed PCIe integration.
Hardware for Project Antares! See all work on Ouroboros Embedded Education channel.
Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects