ti_radar
um-kiho
Components (98)
| Reference | Value | Description |
|---|---|---|
| Q1 | BSS123-7-F | MOSFET N-CH 100V 170MA SOT23-3 |
| U1 | LP87524JRNFRQ1 | 4-A + 2.5-A + Two 1.5-A Buck Converters With Integrated Switches, RNF0026C (VQFN-HR-26) |
| U2 | XI6843ARQGALP | XI6843ARQGALP, ALP0180A (BGA-180) |
| U3 | CP2105-F01-GMR | I/O Controller Interface IC USB to Dual UART bridge |
| U4 | TPS79330DBVR | Single Output High PSRR LDO, 200 mA, Fixed 3 V Output, 2.7 to 5.5 V Input, 5-pin SOT-23 (DBV), -40 to 85 degC, Green (RoHS & no Sb/Br) |
| U5 | TMP112AQDRLRQ1 | Automotive Grade, 1.4V-Capable +/-0.5degC Temperature Sensor with Alert Function and I2C/SMBus, DRL0006A (SOT-OTHER-6) |
| U6 | CAT24C08TDI-GT3 | 8KB I2C SER EEPROM TSOT 23 |
| U7 | BNO085 | IMU ACCEL/GYRO/MAG I2C 32BIT |
| U8 | CC2642R1FRGZR | SimpleLink(TM) Bluetooth(R) 5 low energy Wireless MCU, RGZ0048A (VQFN-48) |
| U9 | MX25R1635FZUIH0 | ULTRA LOW POWER, 16M-BIT [x 1/x 2/x 4] CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY, SON-8 |
| U10 | TCA6408ARSVR | Low-Voltage 8-Bit I2C and SMBus I/O Expander, 1.65 to 5.5 V, -40 to 85 degC, 16-pin UQFN (RSV), Green (RoHS & no Sb/Br) |
| U11 | SN74LVC1G3157DSFR | 1-Channel, 2:1 Analog Switch, DSF0006A (X2SON-6) |
| U12,U17 | TCAN1042HGVDRBRQ1 | Automotive Fault Protected CAN Transceiver With Flexible Data-Rate, DRB0008F (VSON-8) |
| U13 | TS3A5018RSVR | 10-Ohm Quad SPDT Analog Switch, RSV0016A (UQFN-16) |
| U14 | TXB0104QRUTRQ1 | Automotive 4-Bit Bidirectional Voltage-Level Translator with Auto Direction Sensing and +/-15kV ESD, RUT0012A (UQFN-12) |
| U15,U18 | TS5A23157RSER | Dual 10-ohm SPDT Analog Switch, RSE0010A (UQFN-10) |
| U16 | SN74LVC1G11DSFR | AND Gate IC 1 Channel 6-SON (1x1) |
| U19 | TPS2115ADRBR | Dual In / Single Out Autoswitching Power Mux, 2.8 to 5.5 V, -40 to 85 degC, 8-pin SON (DRB), Green (RoHS & no Sb/Br) |
| !PCB? | Printed Circuit Board | Printed Circuit Board |
| A1 | ANT016008LCS2442MA2 | RF ANT 2.4GHZ CHIP SOLDER SMD |
| C1,C4,C7,C42,C50-C53,C55,C59,C62,C65,C70,C73,C78,C82,C122 | CL05A106MP5NUNC | CAP, CERM, 10 uF, 10 V, +/- 20%, X5R, 0402 |
| C2,C3,C6,C9,C10,C12,C13,C25-C27,C35-C37,C40,C43,C72,C86,C91,C92,C101,C105,C107-C109,C114,C117-C120,C123,C126-C128,C130 | GRM033R6YA104KE14D | Cap Ceramic 0.1uF 35V X5R 10% Pad SMD 0201 85C T/R |
| C5,C11,C15,C16,C24,C100,C115,C116,C129 | CL03A105MO3NRNH | 1µF ±20% 16V Ceramic Capacitor X5R 0201 |
| C8,C125 | CL03A103KA3NNNC | CAP CER 10000PF 25V X5R 0201 |
| C14,C71 | GRM0335C1H4R7BA01D | CAP, CERM, 4.7 pF, 50 V,+/- 3%, C0G/NP0, 0201 |
| C17,C18 | GRM0335C1H8R0BA01D | Cap Ceramic 8pF 50V C0G 0.1pF SMD 0201 125°C Paper T/R |
| C19,C20,C38,C39 | 250R05L120JV4T | CAP CER 12PF 25V C0G/NP0 0201 |
| C21,C93 | CL05C120JB5NNNC | CAP, CERM, 12 pF, 50 V, +/- 5%, C0G/NP0, 0402 |
| C22,C23,C41 | GCM1555C1H1R0CA16D | CAP, CERM, 1 pF, 50 V,+/- 25%, C0G/NP0, AEC-Q200 Grade 1, 0402 |
| C28,C29 | CL05A226MQ5N6J8 | CAP CER 22UF 6.3V X5R 0402 |
| C30,C56-C58,C60,C61,C63,C64,C66-C68,C75,C76,C80,C81,C84,C85,C87,C88,C94-C98 | LMK063BJ224MP-F | CAP, CERM, 0.22 uF, 10 V, +/- 20%, X5R, 0201 |
| C31-C34 | TMK063CG391JT-F | CAP CER 390PF 25V C0G/NP0 0201 |
| C44-C47,C111-C113,C121,C131,C133,C135,C137-C141 | CGA4J1X7T0J226M125AC | 22µF ±20% 6.3V Ceramic Capacitor X7T 0805 (2012 Metric) |
| C69 | GRM033R61C473KE84D | CAP, CERM, 0.047 uF, 16 V, +/- 10%, X5R, 0201 |
| C74,C79,C83,C102,C103 | CL03A225MQ3CRNC | CAP, CERM, 2.2 uF, 6.3 V, +/- 20%, X5R, 0201 |
| C89,C90 | CGB2A1X6S0J105K033BC | CAP, CERM, 1 µF, 6.3 V,+/- 10%, X6S, 0402 |
| C99,C104 | GJM1555C1H1R8BB01D | CAP, CERM, 1.8 pF, 50 V,+/- 6%, C0G/NP0, 0402 |
| C106,C110 | GRM155R71H472KA01D | CAP, CERM, 4700 pF, 50 V, +/- 10%, X7R, 0402 |
| C124,C132,C134,C136 | GCM21BR71A106KE22L | CAP, CERM, 10 uF, 10 V, +/- 10%, X7R, 0805 |
| CAUTION HOT SURFACE1 | CAUTION HOT SURFACE | IEC 61010-1 Hot Surface Warning |
| D1,D2 | NSR20F30NXT5G | Diode, Schottky, 30 V, 2 A, 2-XFDFN |
| ESD Susceptible1 | ESD Susceptible | ESD Susceptible Symbol |
| FID1-FID6 | Fiducial | Fiducial mark. There is nothing to buy or mount. |
| FL2-FL4,FL11,FL12,FL14,FL22 | BLM15PD300SZ1D | Inductor, Ferrite Bead, Ferrite, 2.2 A, 0.035 ohm, AEC-Q200 Grade 1, SMD |
| H1-H3 | MechPart | AOP EVM Heatsink,Thermal Pad Pink 406.40mm x 203.20mm Rectangular Adhesive - One Side,xWR6843AOPEVM Mounting stand |
| J1,J5 | 105017-0001 | Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT |
| J2,J11 | QSH-030-01-L-D-A | Receptacle, 0.5 mm, 30x2, Gold, TH |
| J3 | M50-3930442 | CONN HDR 1.27MM R/A AU 4POS |
| J4,J6 | 51441-1093 | Easy-On™ Type FFC/FPC Connector, Right-Angle, Surface Mount, ZIF, Bottom Contact Style, 1.10mm Mated Height, 10 Circuits |
| J7 | GRPB052MWCN-RC | CONN HEADER R/A 10POS 1.27MM |
| J8,J10 | M50-3930342 | CONN HEADER R/A 3POS 1.27MM |
| J9 | U.FL-R-SMT-1(01) | Receptacle, Ultra Miniature Coaxial, Male Pin, 50 ohm, SMT |
| L1,L6 | LQG15HS2N4S02D | Inductor, Multilayer, Air Core, 2.4 nH, 0.3 A, 0.15 ohm, SMD |
| L2-L5 | MCKK2012TR47M | FIXED IND 470NH 4.5A 39 MOHM SMD |
| L7 | MLZ2012N6R8LT000 | Inductor, Multilayer, Ferrite, 6.8 uH, 0.11 A, 0.25 ohm, SMD |
| L8 | BLM18HE152SN1D | Ferrite Bead, 1500 ohm @ 100 MHz, 0.5 A, 0603 |
| L9,L10 | LQG15HS2N0S02D | Inductor, Multilayer, Air Core, 2 nH, 0.3 A, 0.1 ohm, SMD |
| L11-L14 | BLM18KG121TH1D | Ferrite Bead, 120 ohm @ 100 MHz, 1.9 A, 0603 |
| L15 | BLM21PG221SN1D | Ferrite Bead, 220 ohm @ 100 MHz, 2 A, 0805 |
| LBL1,LBL2 | THT-14-423-10 | Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll |
| LD1-LD6 | APHHS1005CGCK | LED, Green, SMD |
| Logo1 | Texas Instruments | Texas Instrument Corporate Signature |
| Logo2 | CE Mark | CE Mark |
| Logo3 | FCC disclaimer | FCC_disclaimer |
| Logo4 | WEEE logo | WEEE logo |
| R1,R3,R7,R8,R18-R23,R35,R36,R43-R45,R59,R65,R77,R78,R80-R85,R93-R96,R98,R104,R110,R118,R122,R124,R125,R134,R177,R178 | RR0306P-103-D | 10 kOhms ±0.5% 0.05W, 1/20W Chip Resistor 0201 (0603 Metric) Thin Film |
| R2,R12,R14,R28,R30-R32,R41,R51,R57,R58,R60-R62,R66-R68,R70-R74,R76,R86,R87,R90,R91,R97,R99-R103,R105,R106,R109,R112,R113,R115,R116,R120,R121,R123,R127-R129,R131,R136,R139,R142-R155,R157,R160,R161,R166,R168,R182-R190 | RC0201JR-070RL | RES SMD 0 OHM JUMPER 1/20W 0201 |
| R4,R5,R9,R29,R37,R89,R92 | CRCW0201100KFKED | RES, 100 k, 1%, 0.05 W, 0201 |
| R6,R46-R49 | CRCW020133R2FNED | RES, 33.2, 1%, 0.05 W, 0201 |
| R10,R11,R88,R130,R132,R133,R135,R137,R138,R140 | AC0201FR-0720RL | RES SMD 20 OHM 1% 1/20W 0201 |
| R13,R15,R17,R42,R111 | RC0201JR-07220RL | RES, 220, 5%, 0.05 W, 0201 |
| R16,R174,R176 | RC0201FR-077K87L | RES, 7.87 k, 1%, 0.05 W, 0201 |
| R24 | CRCW0402200RFKEDHP | RES SMD 200 OHM 1% 1/5W 0402 |
| R25,R26,R33,R34,R38,R40,R64,R69,R141 | RC0201FR-074K99L | RES, 4.99 k, 1%, 0.05 W, 0201 |
| R27,R39,R107,R108 | RC0201JR-07510RL | RES, 510, 5%, 0.05 W, 0201 |
| R50,R75 | RC0201JR-071KL | RES, 1.0 k, 5%, 0.05 W, 0201 |
| R52 | RC0201FR-071K96L | RES, 1.96 k, 1%, 0.05 W, 0201 |
| R53-R56 | RC0402FR-073R83L | RES Thick Film SMD 3.83Ω 1% 1/16W 0402 200ppm/°C |
| R79,R180,R181 | ERJ-1GNF4701C | RESISTOR, 0201, 0.05W, 1%, 4K7 |
| R114,R117,R119,R126 | CRCW040261R9FKED | RES, 61.9, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 |
| R158,R170,R172 | RC0201FR-0782K5L | RES, 82.5 k, 1%, 0.05 W, 0201 |
| R159,R171 | RC0201JR-07750RL | RES, 750, 5%, 0.05 W, 0201 |
| RA1-RA9 | EXB-18VR000X | RES ARRAY 4 RES ZERO OHM 0502 |
| S1,S2 | 218-4LPST | Switch, Slide, SPST 4 poles, SMT |
| S3 | CHS-01TA | SWITCH SLIDE DIP SPST 100MA 6V |
| SW2,SW3 | B3U-1000P | SWITCH TACTILE SPST-NO 0.05A 12V |
| TP2-TP10,TP12-TP19,TP26,TP27,TP46 | TESTPOINT | TEST POINT. No entry in BOM. |
| TP11 | TP_SM_1MM | 1mm Test Point, SMT |
| TP20 | 4953 | PC Test Point, Loop Brass, Tin Plating 0.047" (1.19mm) Hole Diameter Mounting Type |
| Y1 | CX2016DB40000D0FLJCC | CRYSTAL 40.0000MHZ 8PF SMD |
| Y2 | CX2016DB48000C0WPLA2 | 48MHz ±20ppm Crystal 7pF 50 Ohms 4-SMD, No Lead |
| Y3,Y4 | ABS05W-32.768KHZ-D-2-T | CRYSTAL 32.768KHZ 4PF SMD |
| ZZ1 | This Assembly Note is for PCB labels only | This Assembly Note is for PCB labels only |
| ZZ2 | These assemblies are ESD sensitive, ESD precautions shall be observed. | These assemblies are ESD sensitive, ESD precautions shall be observed. |
| ZZ3 | These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. | These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. |
| ZZ4 | These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified. | These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified. |
| ZZ5.1 | Cut the thermal pad(Part Number#GPVOUS-0.125-AC-0816) for the shape and size of the inner surface of the heatsink(Part Number#MCH054) and paste it on the inner surface of the heatsink; | Cut the thermal pad(Part Number#GPVOUS-0.125-AC-0816) for the shape and size of the inner surface of the heatsink(Part Number#160018120021) and paste it on the inner surface of the heatsink; |
| ZZ5.2 | Bring the heatsink onto the PCB bottom side (Opposite side of AOP device). Match the teeth in the heatsink with break-away area in the PCB and press the heatsink onto the PCB slightly so as thermal pad is spread all over the area | Bring the heatsink onto the PCB bottom side (Opposite side of AOP device). Match the teeth in the heatsink with break-away area in the PCB and press the heatsink onto the PCB slightly so as thermal pad is spread all over the area |